The US finalizes a $458M grant for SK Hynix under the CHIPS Act and $500M in loans to build a $3.87B chip packaging facility in Indiana (Mackenzie Hawkins/Bloomberg) 19-12-2024

Mackenzie Hawkins / Bloomberg:
The US finalizes a $458M grant for SK Hynix under the CHIPS Act and $500M in loans to build a $3.87B chip packaging facility in Indiana — – Money will help build a plant and research facility in Indiana — Initial agreement for Chips Act money was announced in August